MPC8377ECVRAGG
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 Series SoC, MPC8377ECVRAGG, is a CMOS-based system-on-chip housed in a 689-ball PBGA (S-PBGA-B689) package. This square, bottom-entry grid array component features a 1.00mm terminal pitch and a seated height not exceeding 2.46mm. Operating within a temperature range of -40°C to 125°C, it requires a supply voltage between 0.95V and 1.05V, with a nominal value of 1.00V. The package body is constructed from plastic/epoxy. This high-performance SoC is engineered for demanding applications in networking, industrial control, and embedded computing.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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