MPC8377CVRANDA
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
Quality Control: Learn More
NXP Semiconductors MPC8377 series System-on-Chip (SoC) featuring a CMOS technology. This component, part number MPC8377CVRANDA, is housed in a 689-ball grid array (BGA) package with part code S-PBGA-B689, measuring 31x31mm with a 1.00mm terminal pitch. It operates within a temperature range of -40°C to +125°C and requires a supply voltage between 1.00V and 1.10V, with a nominal of 1.05V. The plastic/epoxy package is surface-mountable and designed with a heat sink/slug. This high-performance SoC is integral to applications in networking, industrial control, and telecommunications.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.1000 |
| Supply_Voltage_Min | 1.0000 |
| Supply_Voltage_Nom | 1.0500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
Request a Quote
Clients Also Buy
MPC8377EVRANF
SoC, CMOS, PBGA689
MPC8377EVRAGFA
SoC, CMOS, PBGA689
MPC8377EVRAGF
SoC, CMOS, PBGA689