MPC8377CVRAND
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 series System-on-Chip (SoC) is a high-performance, low-power component utilizing CMOS technology. This device, part number MPC8377CVRAND, is housed in a 689-ball Plastic Ball Grid Array (PBGA) package (JESD-30 Code S-PBGA-B689), featuring a square package shape with a terminal pitch of 1.000mm. The operating temperature range is from -40°C to +125°C, with a nominal supply voltage of 1.05V, ranging from 1.00V to 1.10V. This SoC is designed for surface mounting and finds application in industrial networking, telecommunications infrastructure, and storage solutions. The package dimensions are 31.00mm x 31.00mm with a maximum seated height of 2.46mm.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.1000 |
| Supply_Voltage_Min | 1.0000 |
| Supply_Voltage_Nom | 1.0500 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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