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MPC8377CVRALG

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MPC8377CVRALG

SoC, CMOS, PBGA689

Manufacturer: NXP Semiconductors

Categories: Microprocessors

Quality Control: Learn More

NXP Semiconductors MPC8377 series System-on-Chip (SoC) component, part number MPC8377CVRALG, is a high-performance CMOS device. This SoC features a 689-terminal Ball Grid Array (BGA) package, specifically an S-PBGA-B689 (HBGA) with a terminal pitch of 1.000 mm and a square, bottom-mounted terminal form. Operating within a temperature range of -40°C to 125°C, it utilizes a nominal supply voltage of 1.00V, with a maximum of 1.05V and a minimum of 0.95V. The plastic/epoxy package has a seated height of up to 2.4600 mm and dimensions of 31.0000 mm by 31.0000 mm. This component is commonly found in networking, industrial control, and embedded computing applications.

Additional Information

Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:
Technical Details:
Width31.0000
TechnologyCMOS
Length31.0000
JESD_30_CodeS-PBGA-B689
Number_of_Terminals689
Operating_Temperature_Max125.0000
Operating_Temperature_Min-40.0000
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeHBGA
Package_Equivalence_CodeBGA689,29X29,40
Package_ShapeSquare
Package_StyleGRID ARRAY, HEAT SINK/SLUG
Seated_Height_Max2.4600
Supply_Voltage_Max1.0500
Supply_Voltage_Min0.9500
Supply_Voltage_Nom1.0000
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeSoC

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