MPC8377CVRALG
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
Quality Control: Learn More
NXP Semiconductors MPC8377 series System-on-Chip (SoC) component, part number MPC8377CVRALG, is a high-performance CMOS device. This SoC features a 689-terminal Ball Grid Array (BGA) package, specifically an S-PBGA-B689 (HBGA) with a terminal pitch of 1.000 mm and a square, bottom-mounted terminal form. Operating within a temperature range of -40°C to 125°C, it utilizes a nominal supply voltage of 1.00V, with a maximum of 1.05V and a minimum of 0.95V. The plastic/epoxy package has a seated height of up to 2.4600 mm and dimensions of 31.0000 mm by 31.0000 mm. This component is commonly found in networking, industrial control, and embedded computing applications.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 31.0000 |
| Technology | CMOS |
| Length | 31.0000 |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
Request a Quote
Clients Also Buy
MPC8377EVRANF
SoC, CMOS, PBGA689
MPC8377EVRAGFA
SoC, CMOS, PBGA689
MPC8377EVRAGF
SoC, CMOS, PBGA689