MPC8377CVRAJDA
SoC, CMOS, PBGA689Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8377 series SoC, part number MPC8377CVRAJDA, is a high-performance CMOS device housed in a 689-ball S-PBGA (Square Package Ball Grid Array) package. This processor operates within a temperature range of -40°C to 125°C and features a nominal supply voltage of 1.00V, with a minimum of 0.95V and a maximum of 1.05V. The PBGA package measures 31.00mm x 31.00mm with a seated height of 2.46mm and a terminal pitch of 1.00mm, utilizing bottom-positioned solder balls. This component is designed for demanding applications across various industries, including networking, industrial automation, and storage systems, where robust processing capabilities and efficient power management are critical.
Additional Information
Series: MPC8377RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 31.0000 |
| Width | 31.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B689 |
| Number_of_Terminals | 689 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | HBGA |
| Package_Equivalence_Code | BGA689,29X29,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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