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MPC8347VVAJDB

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MPC8347VVAJDB

SoC, CMOS, PBGA672

Manufacturer: NXP Semiconductors

Categories: Microprocessors

Quality Control: Learn More

NXP Semiconductors MPC8347 series System-on-Chip (SoC) device, part number MPC8347VVAJDB. This CMOS SoC is housed in a 672-ball Plastic Ball Grid Array (PBGA) package, specifically S-PBGA-B672, with a terminal pitch of 1.000 mm. It features a square, low-profile grid array package style with a maximum seated height of 1.6900 mm. The operating temperature range for this component is 0°C to 105°C, with a nominal supply voltage of 1.2000 V, and a range from 1.1400 V to 1.2600 V. This surface-mount device is suitable for applications in networking, industrial control, and consumer electronics.

Additional Information

Series: MPC8347RoHS Status: RoHS CompliantManufacturer Lead Time: 1Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
Length35.0000
Width35.0000
TechnologyCMOS
JESD_30_CodeS-PBGA-B672
Number_of_Terminals672
Operating_Temperature_Max105.0000
Operating_Temperature_Min0.0000
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeLBGA
Package_Equivalence_CodeBGA672,34X34,40
Package_ShapeSquare
Package_StyleGRID ARRAY, LOW PROFILE
Seated_Height_Max1.6900
Supply_Voltage_Max1.2600
Supply_Voltage_Min1.1400
Supply_Voltage_Nom1.2000
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeSoC

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