MPC8347EZUALFA
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8347 series System-on-Chip (SoC) designed with advanced CMOS technology. This component, part number MPC8347EZUALFA, features a 672-ball grid array (BGA) package with a low profile, square shape, and a terminal pitch of 1.00mm. It operates within a temperature range of 0°C to 105°C and requires a nominal supply voltage of 1.20V, with a maximum of 1.26V and a minimum of 1.14V. The MPC8347EZUALFA is suitable for high-performance applications in networking, industrial automation, and telecommunications. Its LBGA package construction ensures robust surface mounting capabilities.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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