MPC8347EZUAJDB
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8347EZUAJDB is a CMOS System-on-Chip (SoC) in an S-PBGA-B672 package. This low-profile, square grid array component features 672 solder balls with a 1.000 mm pitch. Designed for applications requiring robust processing capabilities, it operates within a temperature range of 0°C to 105°C and has a nominal supply voltage of 1.20V, with a maximum rating of 1.26V and a minimum of 1.14V. The package body is constructed from plastic/epoxy. This SoC is utilized in various industries, including networking, industrial automation, and embedded systems. The MPC8347 series offers a versatile platform for complex control and data processing tasks.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |