MPC8347EZUAGFA
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347EZUAGFA is a high-performance System-on-Chip (SoC) designed for demanding embedded applications. This CMOS device features a 672-ball plastic ball grid array (PBGA) package, specifically a low-profile square grid array with a 1.00 mm terminal pitch. Operating within a temperature range of 0°C to 105°C, it requires a nominal supply voltage of 1.20V, with a maximum rating of 1.26V and a minimum of 1.14V. The MPC8347 series SoC is suitable for applications in networking, industrial automation, and telecommunications. Its robust construction and advanced technology ensure reliable performance in challenging environments.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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