MPC8347EVVALD
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347EVVALD is a high-performance CMOS System-on-Chip (SoC) designed for demanding applications. This component, part of the MPC8347 series, features a 672-ball PBGA (Plastic Ball Grid Array) package with a low-profile square shape, measuring 35x35mm with a 1.00mm terminal pitch. Operating within a temperature range of 0°C to 105°C, it utilizes a nominal supply voltage of 1.20V, with a range of 1.14V to 1.26V. This SoC is suitable for industrial automation, networking infrastructure, and advanced embedded systems. Its advanced architecture and robust construction ensure reliable performance in challenging environments.
Additional Information
Series: MPC8347RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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