MPC8347EVVADD
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347EVVADD is a high-performance CMOS System-on-Chip (SoC) from the MPC8347 series. This component is housed in a 672-ball PBGA (Plastic Ball Grid Array) package, specifically S-PBGA-B672, with a terminal pitch of 1.000mm. It operates within an ambient temperature range of 0°C to 105°C and requires a supply voltage between 1.14V and 1.26V, with a nominal value of 1.20V. The LBGA package features a square, low-profile grid array style with a seated height of up to 1.69mm. This device is suitable for surface mounting and finds application in networking, industrial control, and telecommunications sectors where robust processing capabilities are essential.
Additional Information
Series: MPC8347RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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