MPC8347EVRADFA
SoC, CMOS, PBGA620Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8347EVRADFA is a CMOS System-on-Chip (SoC) housed in a 620-ball PBGA package (S-PBGA-B620) with a 1.000mm terminal pitch. This square, bottom-terminated grid array component operates within a temperature range of 0°C to 105°C and supports a supply voltage of 1.14V to 1.26V, with a nominal of 1.20V. The package dimensions are 29.000mm x 29.000mm, with a maximum seated height of 2.4600mm. Its plastic/epoxy construction and surface-mount design make it suitable for high-density applications. The MPC8347 series SoC is commonly utilized in networking infrastructure, industrial control systems, and embedded multimedia devices.
Additional Information
Series: MPC8347RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 29.0000 |
| Technology | CMOS |
| Length | 29.0000 |
| JESD_30_Code | S-PBGA-B620 |
| Number_of_Terminals | 620 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA620,28X28,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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