MPC8347ECZUALD
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8347 series SoC, part number MPC8347ECZUALD, is a CMOS electronic component in an S-PBGA-B672 package. This low-profile, square grid array package features 672 bottom-mounted solder balls with a 1.000 mm terminal pitch. Designed for surface mounting, it operates within a temperature range of -40°C to 105°C and utilizes a nominal supply voltage of 1.20V, with a maximum of 1.26V and a minimum of 1.14V. The package body is constructed from plastic/epoxy. This SoC is employed in networking, industrial control, and telecommunications applications.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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