MPC8347ECZUAJD
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347 series SoC, part number MPC8347ECZUAJD, is a high-performance System-on-Chip built on CMOS technology. This component features a 672-terminal, square, low-profile, plastic/epoxy PBGA package (JESD_30 Code: S-PBGA-B672) with a terminal pitch of 1.000 mm and ball terminals on the bottom. Operating within a temperature range of -40°C to 105°C, this device supports a nominal supply voltage of 1.20V, with a minimum of 1.14V and a maximum of 1.26V. The MPC8347ECZUAJD is designed for surface mounting and is utilized across various industries including networking, industrial control, and embedded systems where robust processing capabilities are essential.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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