MPC8347ECZUAGFB
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8347 Series System-on-Chip (SoC) in a 672-ball PBGA (S-PBGA-B672) package. This CMOS device operates with a supply voltage range of 1.14V to 1.26V, nominal at 1.20V, and features a wide operating temperature range from -40°C to +105°C. The square, low-profile grid array package has a terminal pitch of 1.00mm and a seated height of up to 1.69mm. Its robust design and performance characteristics make it suitable for applications in networking, industrial automation, and consumer electronics. The MPC8347ECZUAGFB is a surface-mount component utilizing bottom-positioned ball terminals.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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