MPC8347ECZQADF
SoC, CMOS, PBGA620Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347ECZQADF is a high-performance, 32-bit PowerPC-based System-on-Chip (SoC) designed for demanding embedded applications. This device integrates a core processor, memory controllers, and a rich set of peripherals within a compact 620-ball PBGA package. Built on advanced CMOS technology, it operates across a temperature range of -40°C to +105°C and supports a supply voltage of 1.14V to 1.26V, with a nominal of 1.20V. The MPC8347 series SoC is utilized in networking infrastructure, industrial automation, and consumer electronics. Its robust feature set and package dimensions of 29x29mm make it suitable for space-constrained designs requiring significant processing power and I/O connectivity. The 1.00mm terminal pitch and bottom-terminated ball grid array facilitate efficient board layout and assembly.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 29.0000 |
| Width | 29.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B620 |
| Number_of_Terminals | 620 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA620,28X28,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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