MPC8347ECVVAJD
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
Quality Control: Learn More
NXP Semiconductors MPC8347 Series SoC, part number MPC8347ECVVAJD, is a CMOS technology device housed in an S-PBGA-B672 package. This low-profile, square grid array package features 672 solder balls with a 1.00 mm terminal pitch, designed for surface mounting. The device operates within a temperature range of -40°C to 105°C and has a nominal supply voltage of 1.20V, with a maximum of 1.26V and a minimum of 1.14V. Its applications span networking, industrial automation, and consumer electronics, leveraging its advanced processing capabilities. The package dimensions are 35.00 mm x 35.00 mm, with a maximum seated height of 1.69 mm.
Additional Information
Series: MPC8347RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
Request a Quote
Clients Also Buy
MPC8347CZQALFB
SoC, CMOS, PBGA620
MPC8347ECZUALFB
SoC, CMOS, PBGA672
MPC8347EZUAGFB
SoC, CMOS, PBGA672