MPC8347ECVVADF
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347ECVVADF is a high-performance CMOS System-on-Chip (SoC) housed in a 672-ball Grid Array package (PBGA672, S-PBGA-B672). This device operates within an extended temperature range of -40°C to +105°C with a nominal supply voltage of 1.20V, supporting a range from 1.14V to 1.26V. Featuring a 1.00mm terminal pitch and a low-profile square package measuring 35x35mm, it is designed for surface mounting. The MPC8347ECVVADF finds application in networking, industrial control, and embedded computing systems where robust processing capabilities and power efficiency are critical.
Additional Information
Series: MPC8347RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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