MPC8347CZQADF
SoC, CMOS, PBGA620Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347 is a high-performance, low-power System-on-Chip (SoC) designed for demanding embedded applications. This CMOS device, part number MPC8347CZQADF, features a 620-ball grid array (BGA) package, specifically a square S-PBGA-B620 with a 1.00mm terminal pitch. It operates within a temperature range of -40°C to 105°C and utilizes a nominal 1.20V supply voltage. The MPC8347 SoC is suitable for use in networking infrastructure, industrial automation, and consumer electronics where robust processing capabilities and power efficiency are critical. Its 620-terminal configuration and square package shape, measuring 29.00mm x 29.00mm with a maximum seated height of 2.46mm, facilitate complex board designs.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 29.0000 |
| Width | 29.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B620 |
| Number_of_Terminals | 620 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA620,28X28,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 2.4600 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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