MPC8347CVVAGF
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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The NXP Semiconductors MPC8347 series SoC, part number MPC8347CVVAGF, is a high-performance, low-power CMOS System-on-Chip designed for advanced embedded applications. This device features a 672-terminal PBGA package with a square, low-profile grid array style and a terminal pitch of 1.000 mm, measuring 35.000 mm by 35.000 mm. It operates within a temperature range of -40°C to 105°C and utilizes a nominal supply voltage of 1.20V, with a maximum of 1.26V and a minimum of 1.14V. Its plastic/epoxy package body material ensures robust construction. The MPC8347CVVAGF is suitable for use in networking infrastructure, industrial control systems, and consumer electronics where processing power and power efficiency are critical.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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