MPC8347CVVADDB
SoC, CMOS, PBGA672Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8347 series System-on-Chip (SoC), part number MPC8347CVVADDB. This CMOS device features a 672-ball, low-profile plastic BGA (PBGA) package (S-PBGA-B672) with a 1.00mm terminal pitch. Designed for surface mounting, it operates within an extended temperature range from -40°C to 105°C, with a nominal supply voltage of 1.20V, ranging from 1.14V to 1.26V. The MPC8347CVVADDB is suitable for applications in networking, industrial control, and embedded systems, leveraging its robust architecture for demanding processing tasks. Its square package body measures 35.00mm x 35.00mm with a maximum seated height of 1.69mm.
Additional Information
Series: MPC8347RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 35.0000 |
| Width | 35.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B672 |
| Number_of_Terminals | 672 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA672,34X34,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Seated_Height_Max | 1.6900 |
| Supply_Voltage_Max | 1.2600 |
| Supply_Voltage_Min | 1.1400 |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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