MPC8309CVMAHDCA
SoC, CMOS, PBGA489Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8309 Series System-on-Chip (SoC), part number MPC8309CVMAHDCA. This CMOS device features a 489-ball PBGA package with a 0.800mm terminal pitch and a seated height not exceeding 1.6100mm. Operating within a temperature range of -40°C to 105°C, it requires a supply voltage of 0.95V to 1.05V, nominal at 1.00V. The device is designed for surface mounting and utilizes a square, low-profile, fine-pitch grid array package style. Applications span industrial automation, networking infrastructure, and automotive systems, leveraging its robust processing capabilities for complex embedded designs.
Additional Information
Series: MPC8309RoHS Status: Manufacturer Lead Time: Product Status: EOLPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 19.0000 |
| Width | 19.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B489 |
| Number_of_Terminals | 489 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA489,23X23,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.6100 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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