MPC8309CVMAGFCA
SoC, CMOS, PBGA489Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MPC8309CVMAGFCA is a high-performance System-on-Chip (SoC) utilizing advanced CMOS technology. This component, part of the MPC8309 series, features a 489-ball grid array (BGA) package, specifically a low-profile, fine-pitch PBGA (S-PBGA-B489) with a terminal pitch of 0.800 mm. It operates within a supply voltage range of 0.95V to 1.05V, with a nominal voltage of 1.00V, and supports an extended operating temperature range from -40°C to +105°C. The plastic/epoxy package body ensures robust environmental protection. This SoC is well-suited for applications in networking, industrial control, and embedded computing where high integration and processing power are critical.
Additional Information
Series: MPC8309RoHS Status: Manufacturer Lead Time: Product Status: EOLPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 19.0000 |
| Width | 19.0000 |
| Technology | CMOS |
| JESD_30_Code | S-PBGA-B489 |
| Number_of_Terminals | 489 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA489,23X23,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Seated_Height_Max | 1.6100 |
| Supply_Voltage_Max | 1.0500 |
| Supply_Voltage_Min | 0.9500 |
| Supply_Voltage_Nom | 1.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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