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MCIMX31LDVMN5DR2

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MCIMX31LDVMN5DR2

SoC, PBGA473

Manufacturer: NXP Semiconductors

Categories: Microprocessors

Quality Control: Learn More

NXP Semiconductors MCIMX31LDVMN5 series SoC, P/N MCIMX31LDVMN5DR2, is housed in a 473-ball Plastic Ball Grid Array (PBGA) package with a 0.800mm terminal pitch. This device operates within an industrial temperature range of -20°C to 70°C. Designed for high-performance applications, this System-on-Chip (SoC) integrates advanced processing capabilities for demanding embedded systems. Its extensive peripheral set and robust architecture make it suitable for use in industrial automation, medical equipment, and advanced consumer electronics. The component is supplied on 13-inch tape and reel packaging.

Additional Information

Series: MCIMX31LDVMN5RoHS Status: RoHS CompliantManufacturer Lead Time: 13Product Status: ActivePackaging: TR, 13 INCHDatasheet:
Technical Details:
JESD_30_CodeS-PBGA-B473
Number_of_Terminals473
Operating_Temperature_Max70.0000
Operating_Temperature_Min-20.0000
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeFBGA
Package_Equivalence_CodeBGA473,23X23,32
Package_ShapeSquare
Package_StyleGRID ARRAY, FINE PITCH
Surface_MountYes
Terminal_FormBall
Terminal_Pitch0.800
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeSoC

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