MCIMX31LDVMN5DR2
SoC, PBGA473Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MCIMX31LDVMN5 series SoC, P/N MCIMX31LDVMN5DR2, is housed in a 473-ball Plastic Ball Grid Array (PBGA) package with a 0.800mm terminal pitch. This device operates within an industrial temperature range of -20°C to 70°C. Designed for high-performance applications, this System-on-Chip (SoC) integrates advanced processing capabilities for demanding embedded systems. Its extensive peripheral set and robust architecture make it suitable for use in industrial automation, medical equipment, and advanced consumer electronics. The component is supplied on 13-inch tape and reel packaging.
Additional Information
Series: MCIMX31LDVMN5RoHS Status: RoHS CompliantManufacturer Lead Time: 13Product Status: ActivePackaging: TR, 13 INCHDatasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B473 |
| Number_of_Terminals | 473 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | -20.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA473,23X23,32 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.800 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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