MCIMX31LDVKN5DR2
SoC, PBGA457Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors MCIMX31LDVKN5DR2 is a System on Chip (SoC) with a 457-ball Fine Pitch Ball Grid Array (FBGA) package. This device, part of the MCIMX31LDVKN5 series, features a square package with a terminal pitch of 0.500 mm and terminals on the bottom. It operates within an ambient temperature range of -20°C to 70°C and is constructed with plastic/epoxy material. The MCIMX31LDVKN5DR2 is commonly found in industrial automation, automotive infotainment, and medical imaging applications. It is supplied on 13-inch tape and reel packaging.
Additional Information
Series: MCIMX31LDVKN5RoHS Status: RoHS CompliantManufacturer Lead Time: 7Product Status: ActivePackaging: TR, 13 INCHDatasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B457 |
| Number_of_Terminals | 457 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | -20.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | FBGA |
| Package_Equivalence_Code | BGA457,26X26,20 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, FINE PITCH |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.500 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | SoC |
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