LA9310S7S11AA
RISC Microprocessor, CMOS, PBGA157Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors LA9310S7S11AA is a CMOS RISC microprocessor featuring a PBGA157 package. This component operates at a maximum clock frequency of 307 MHz and supports low-power modes. It includes 67584 words of RAM and an 8-bit on-chip data RAM width, with no integrated cache. The S-PBGA-B157 package code indicates a square, low-profile, fine-pitch grid array with 157 terminals on a 0.500 mm pitch. Operating temperature ranges from 0°C to 105°C. Boundary scan functionality is supported. This microprocessor is suitable for applications in automotive, industrial, and consumer electronics.
Additional Information
Series: LA9310S7S11RoHS Status: RoHS CompliantManufacturer Lead Time: 26Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Width | 8.0000 |
| Technology | CMOS |
| Length | 8.0000 |
| Boundary_Scan | Yes |
| Clock_Frequency_Max | 307.0000000000000000 |
| Integrated_Cache | No |
| JESD_30_Code | S-PBGA-B157 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 157 |
| On_Chip_Data_RAM_Width | 8 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LFBGA |
| Package_Equivalence_Code | BGA157,15X15,20 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| RAM_words | 67584 |
| Seated_Height_Max | 1.2600 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.500 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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