C3ENPA1-DS/D
RISC Microprocessor, 32-Bit, 180MHz, CMOS, CBGA728Manufacturer: NXP Semiconductors
Categories: Microprocessors
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NXP Semiconductors C3ENPA1-DS-D is a 32-bit RISC microprocessor operating at a maximum clock frequency of 180MHz. This CMOS device features a 728-ball ceramic, metal-sealed cofired HBGA package (JESD30 code S-CBGA-B728) with a terminal pitch of 1.00mm. It supports a 12-bit address bus and a 139-bit external data bus. The microprocessor operates within a supply voltage range of 1.04V to 1.20V, with a nominal voltage of 1.16V. Boundary scan is supported. The operating temperature range is from -40°C to +125°C. This component is suitable for applications in industrial automation, automotive, and high-performance computing.
Additional Information
Series: C3ENPA1RoHS Status: Manufacturer Lead Time: Product Status: Active-UnconfirmedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Length | 28.0000 |
| Speed | 180.00000000 |
| Width | 28.0000 |
| Technology | CMOS |
| Address_Bus_Width | 12 |
| Bit_Size | 32 |
| Boundary_Scan | Yes |
| Clock_Frequency_Max | 180.0000000000000000 |
| External_Data_Bus_Width | 139 |
| Integrated_Cache | No |
| JESD_30_Code | S-CBGA-B728 |
| Low_Power_Mode | No |
| Number_of_Terminals | 728 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | HBGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, HEAT SINK/SLUG |
| Seated_Height_Max | 3.3900 |
| Supply_Voltage_Max | 1.2000 |
| Supply_Voltage_Min | 1.0400 |
| Supply_Voltage_Nom | 1.1600 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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