
Manufacturer: NXP Semiconductors
Categories: Microcontrollers
Quality Control: Learn More
| Format | Floating Point |
| Length | 17.0000 |
| Speed | 116.00000000 |
| Width | 17.0000 |
| Technology | CMOS |
| Connectivity | CAN(6), ETHERNET, I2C(4), SCI(6), SPI(4) |
| Peripherals | DMA(16), RTC, TIMER(24), WDT |
| A_D_Converters | 36-Ch 10-Bit |
| ADC_Channels | Yes |
| Additional_Feature | ADC 32-Ch 10-Bit ALSO AVAILABLE |
| Address_Bus_Width | 0 |
| Bit_Size | 32 |
| Boundary_Scan | Yes |
| Clock_Frequency_Max | 40.0000000000000000 |
| CPU_Family | e200 |
| DAC_Channels | No |
| Data_EEPROM_Size | 0 |
| Data_RAM_Size | 606208 |
| DMA_Channels | Yes |
| External_Data_Bus_Width | 0 |
| Integrated_Cache | Yes |
| JESD_30_Code | S-PBGA-B256 |
| Low_Power_Mode | Yes |
| Number_of_DMA_Channels | 16 |
| Number_of_External_Interrupts | 316 |
| Number_of_I_O_Lines | 155 |
| Number_of_Serial_I_Os | 12 |
| Number_of_Terminals | 256 |
| Number_of_Timers | 24 |
| On_Chip_Data_RAM_Width | 8 |
| Operating_Temperature_Max | 105.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA256,16X16,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Program_Memory_Size | 2097152 |
| Program_Memory_Type | FLASH |
| Program_Memory_Width | 8 |
| PWM_Channels | No |
| Seated_Height_Max | 1.6000 |
| Supply_Current_Max | 340.00000000 |
| Supply_Voltage_Max | 5.5000 |
| Supply_Voltage_Min | 5.0000 |
| Supply_Voltage_Nom | 5.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROCONTROLLER, RISC |