ISP1362EE,518
USB Bus Controller, CMOS, PBGA64Manufacturer: NXP Semiconductors
Categories: Bus Controllers
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NXP Semiconductors ISP1362EE-518 is a CMOS USB bus controller featuring a 64-terminal, thin profile, fine-pitch Ball Grid Array (BGA) package (JESD30 Code: S-PBGA-B64). This component operates from a 3.0V to 3.6V supply voltage, with a nominal 3.3V, and supports a maximum clock frequency of 12.000 MHz. It facilitates data transfer rates up to 10.000 Mbps, compatible with a wide range of processor architectures including ARM7, ARM9, MIPS, and PowerPC, among others, via its 16-bit external data bus. The ISP1362 series component is designed for applications requiring robust USB connectivity, finding utility in automotive, industrial automation, and consumer electronics sectors. Its operating temperature range is -40°C to +85°C.
Additional Information
Series: ISP1362RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 6.0000 |
| Width | 6.0000 |
| Technology | CMOS |
| Address_Bus_Width | 2 |
| Bus_Compatibility | SH-3; STRONGARM; XA; SPARCLITE; MIPS; ARM7; ARM9; DRAGONBALL; POWERPC |
| Clock_Frequency_Max | 12.0000000000000000 |
| Data_Transfer_Rate_Max | 10.0000000000000000 |
| External_Data_Bus_Width | 16 |
| JESD_30_Code | S-PBGA-B64 |
| Number_of_Terminals | 64 |
| Operating_Temperature_Max | 85.0000 |
| Operating_Temperature_Min | -40.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | TFBGA |
| Package_Equivalence_Code | BGA64,10X10,20 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Seated_Height_Max | 1.1000 |
| Supply_Voltage_Max | 3.6000 |
| Supply_Voltage_Min | 3.0000 |
| Supply_Voltage_Nom | 3.3000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 0.500 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
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