Home

Products

Integrated Circuits (ICs)

Linear

Amplifiers

Instrumentation, Op Amps, Buffer Amps

NJM2068V-TE1

Banner
productimage

NJM2068V-TE1

IC OPAMP GP 2 CIRCUIT 8SSOP

Manufacturer: Nisshinbo Micro Devices Inc.

Categories: Instrumentation, Op Amps, Buffer Amps

Quality Control: Learn More

Nisshinbo Micro Devices Inc. NJM2068V-TE1 is a dual, general-purpose operational amplifier designed for a wide range of applications including audio processing and industrial control systems. This device features a 27 MHz gain bandwidth product and a 6 V/µs slew rate, facilitating efficient signal amplification. The NJM2068V-TE1 operates from a supply voltage range of 8 V to 36 V and exhibits a low input bias current of 150 nA, with an input offset voltage of 300 µV. Housed in an 8-SSOP package (8-LSSOP), this surface-mount component is supplied on tape and reel. Its typical supply current is 5 mA and it operates within an ambient temperature range of -20°C to 75°C.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 12 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:
Technical Details:
PackagingTape & Reel (TR)
Package / Case8-LSSOP (0.173"", 4.40mm Width)
Output Type-
Mounting TypeSurface Mount
Amplifier TypeGeneral Purpose
Operating Temperature-20°C ~ 75°C
Current - Supply5mA
Slew Rate6V/µs
Gain Bandwidth Product27 MHz
Current - Input Bias150 nA
Voltage - Input Offset300 µV
Supplier Device Package8-SSOP
Number of Circuits2
Voltage - Supply Span (Min)8 V
Voltage - Supply Span (Max)36 V

Request a Quote

Name (required)

Phone (required)

Work Email (required)

Country (required)

Company Name (required)

CAPTCHA

By providing a telephone number and submitting the form, you are consenting to be contacted by SMS text message and agreeing to our Privacy Policy. Message frequency may vary. Message and data rates may apply. Reply STOP to opt out of further messaging. Reply HELP for more information.
Clients Also Buy
Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.