Molex 534600619 is a 2.0mm Upright DIP Wafer Assembly designed for robust interconnect solutions. This electronic component features a 6-position configuration, offering a compact and reliable interface. Manufactured by Molex, a leader in interconnectivity, this assembly is suitable for applications requiring durable and efficient data transfer. Its upright DIP mounting style facilitates straightforward PCB integration. Commonly utilized in consumer electronics and industrial automation, this Molex connector assembly provides a dependable connection point for various system architectures. The product is supplied in box packaging.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: Box