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M2S100T-FCG1152

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M2S100T-FCG1152

IC SOC CORTEX-M3 166MHZ 1152BGA

Manufacturer: Microsemi Corporation

Categories: System On Chip (SoC)

Quality Control: Learn More

Microsemi Corporation's M2S100T-FCG1152 is an ARM® Cortex®-M3 based System On Chip (SoC) from the SmartFusion®2 series. This device integrates a 166MHz processor core with a 100K logic module FPGA fabric, offering a flexible platform for complex embedded designs. The M2S100T-FCG1152 features 512KB of flash memory and 64KB of RAM, alongside comprehensive connectivity options including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. On-chip peripherals support DDR memory, PCIe, and SERDES interfaces. This component is commonly utilized in industrial automation, communications infrastructure, and defense applications, operating within a temperature range of 0°C to 85°C (TJ). The device is supplied in an 1152-FCBGA (35x35) package, delivered in trays.

Additional Information

Series: SmartFusion®2RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case1152-BBGA, FCBGA
Speed166MHz
RAM Size64kb
Operating Temperature0°C ~ 85°C (TJ)
Core ProcessorARM® Cortex®-M3
Primary AttributesFPGA - 100K Logic Modules
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
PeripheralsDDR, PCIe, SERDES
Supplier Device Package1152-FCBGA (35x35)
ArchitectureMCU, FPGA
Flash Size512KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
Frequently Asked Questions

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After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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