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M2S100S-1FC1152I

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M2S100S-1FC1152I

IC SOC CORTEX-M3 166MHZ 1152BGA

Manufacturer: Microsemi Corporation

Categories: System On Chip (SoC)

Quality Control: Learn More

The Microsemi Corporation SmartFusion®2 M2S100S-1FC1152I is an ARM® Cortex®-M3 based System on Chip (SoC) featuring a 166MHz core processor. This device integrates a 100K logic module FPGA fabric with 64kb of RAM and 512KB of Flash memory. Connectivity options include CANbus, Ethernet, I2C, SPI, UART/USART, and USB. It also supports peripherals such as DDR, PCIe, and SERDES. The M2S100S-1FC1152I is housed in an 1152-FCBGA (35x35) package and operates across an industrial temperature range of -40°C to 100°C (TJ). This component is commonly utilized in industrial automation, communications, and defense applications.

Additional Information

Series: SmartFusion®2RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case1152-BBGA, FCBGA
Speed166MHz
RAM Size64kb
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorARM® Cortex®-M3
Primary AttributesFPGA - 100K Logic Modules
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
PeripheralsDDR, PCIe, SERDES
Supplier Device Package1152-FCBGA (35x35)
ArchitectureMCU, FPGA
Flash Size512KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

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Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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