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M2S090S-1FG676I

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M2S090S-1FG676I

IC SOC CORTEX-M3 166MHZ 676FBGA

Manufacturer: Microsemi Corporation

Categories: System On Chip (SoC)

Quality Control: Learn More

Microsemi Corporation's M2S090S-1FG676I is a SmartFusion®2 System-on-Chip (SoC) device featuring an ARM® Cortex®-M3 core operating at 166MHz. This FPGA-based SoC integrates 90K logic modules, offering a robust platform for complex embedded designs. Connectivity options include CANbus, Ethernet, I2C, SPI, UART/USART, and USB. On-chip resources comprise 512KB of Flash memory and 64KB of RAM, complemented by high-performance peripherals such as DDR, PCIe, and SERDES. The device is housed in a 676-FBGA (27x27) package and operates within an industrial temperature range of -40°C to 100°C (TJ). Applications for this component are found in the industrial, defense, and aerospace sectors.

Additional Information

Series: SmartFusion®2RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case676-BGA
Speed166MHz
RAM Size64kb
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorARM® Cortex®-M3
Primary AttributesFPGA - 90K Logic Modules
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
PeripheralsDDR, PCIe, SERDES
Supplier Device Package676-FBGA (27x27)
ArchitectureMCU, FPGA
Flash Size512KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

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Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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