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M2S025S-1FG484I

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M2S025S-1FG484I

IC SOC CORTEX-M3 166MHZ 484FBGA

Manufacturer: Microsemi Corporation

Categories: System On Chip (SoC)

Quality Control: Learn More

Microsemi Corporation's M2S025S-1FG484I is a SmartFusion®2 System On Chip (SoC) featuring an ARM® Cortex®-M3 core operating at 166MHz. This device integrates a 25K logic module FPGA fabric with an MCU subsystem, offering a powerful solution for complex embedded applications. The M2S025S-1FG484I boasts 256KB of Flash and 64KB of RAM, along with extensive connectivity options including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. On-chip peripherals support DDR, PCIe, and SERDES. Designed for demanding environments, this component operates within a temperature range of -40°C to 100°C (TJ) and is supplied in a 484-FPBGA (23x23) package. Its hybrid MCU and FPGA architecture makes it suitable for applications in the aerospace, defense, industrial, and communications sectors.

Additional Information

Series: SmartFusion®2RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case484-BGA
Speed166MHz
RAM Size64kb
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorARM® Cortex®-M3
Primary AttributesFPGA - 25K Logic Modules
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
PeripheralsDDR, PCIe, SERDES
Supplier Device Package484-FPBGA (23x23)
ArchitectureMCU, FPGA
Flash Size256KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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