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A2F060M3E-CSG288

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A2F060M3E-CSG288

IC SOC CORTEX-M3 80MHZ 288CSP

Manufacturer: Microsemi Corporation

Categories: System On Chip (SoC)

Quality Control: Learn More

Microsemi Corporation's SmartFusion® A2F060M3E-CSG288 is an ARM® Cortex®-M3 System On Chip (SOC) integrating a ProASIC®3 FPGA with 60K logic gates and 1536 D-flip-flops. This device operates at 80MHz and features 128KB of Flash memory and 16KB of RAM. Connectivity options include EBI/EMI, I2C, SPI, and UART/USART. Peripherals such as DMA, POR, and WDT are also included. The A2F060M3E-CSG288 is housed in a 288-CSP (11x11) package and is designed for operation within a 0°C to 85°C temperature range. This component is utilized in industrial automation, medical devices, and communications infrastructure.

Additional Information

Series: SmartFusion®RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case288-TFBGA, CSPBGA
Speed80MHz
RAM Size16KB
Operating Temperature0°C ~ 85°C (TJ)
Core ProcessorARM® Cortex®-M3
Primary AttributesProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
ConnectivityEBI/EMI, I2C, SPI, UART/USART
PeripheralsDMA, POR, WDT
Supplier Device Package288-CSP (11x11)
ArchitectureMCU, FPGA
Flash Size128KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

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Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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