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A2F060M3E-1FGG256

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A2F060M3E-1FGG256

IC SOC CORTEX-M3 100MHZ 256FBGA

Manufacturer: Microsemi Corporation

Categories: System On Chip (SoC)

Quality Control: Learn More

The Microsemi Corporation A2F060M3E-1FGG256 is an ARM Cortex-M3 based System on Chip (SoC) featuring a ProASIC3 FPGA fabric. This device offers 60K logic gates and 1536 D-Flip-Flops, operating at a core speed of 100MHz. It includes 128KB of Flash memory and 16KB of RAM, alongside peripherals such as DMA, POR, and WDT. Connectivity options include EBI/EMI, I2C, SPI, and UART/USART. The component is housed in a 256-FPBGA (17x17) package and operates within a temperature range of 0°C to 85°C (TJ). This SmartFusion® series device is suitable for applications in industrial control, communications infrastructure, and consumer electronics.

Additional Information

Series: SmartFusion®RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case256-LBGA
Speed100MHz
RAM Size16KB
Operating Temperature0°C ~ 85°C (TJ)
Core ProcessorARM® Cortex®-M3
Primary AttributesProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
ConnectivityEBI/EMI, I2C, SPI, UART/USART
PeripheralsDMA, POR, WDT
Supplier Device Package256-FPBGA (17x17)
ArchitectureMCU, FPGA
Flash Size128KB

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SoC FAQs

A System-on-Chip (SoC) is an integrated circuit that combines processors, memory, communication interfaces, and peripherals onto a single chip to reduce power consumption and improve efficiency.

A SoC works by integrating multiple computing functions into one semiconductor device, enabling processors, memory, graphics, and connectivity modules to communicate efficiently within a compact architecture.

SoCs are used in:

  • Smartphones
  • IoT devices
  • Wearable technology
  • Automotive electronics
  • Embedded systems
  • Edge computing
Frequently Asked Questions

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After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.

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