EDI8L24129V15BC
SRAM Module, 128KX24, 15ns, CMOS, PBGA119Manufacturer: Microsemi Corporation
Categories: SRAMs
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The Microsemi Corporation EDI8L24129V15BC is a high-performance SRAM module from the EDI8L24129 series. This component features a memory organization of 128K words by 24 bits, providing a total density of 3,145,728 bits. It operates asynchronously with a maximum access time of 15ns. Fabricated using CMOS technology, this module supports a supply voltage range of 3.135V to 3.465V, with a nominal value of 3.3V. The EDI8L24129V15BC is housed in a 119-ball PBGA (Plastic Ball Grid Array) package, identified by the R-PBGA-B119 code, with a rectangular shape and bottom-mounted ball terminals. Its surface-mount capability and robust construction make it suitable for demanding applications in telecommunications, industrial automation, and high-speed data processing systems. The operating temperature range is from 0°C to 70°C.
Additional Information
Series: EDI8L24129RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Time_Max | 15.0000000000000000 |
| JESD_30_Code | R-PBGA-B119 |
| Memory_Density | 3145728.0000000000000000 |
| Memory_IC_Type | SRAM MODULE |
| Memory_Organization | 128KX24 |
| Memory_Width | 24 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 119 |
| Number_of_Words | 131072.0000000000000000 |
| Number_of_Words_Code | 128K |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 70.0 |
| Operating_Temperature_Min | 0.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 2.7900 |
| Supply_Voltage_Max | 3.46500 |
| Supply_Voltage_Min | 3.13500 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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