5962-9461107HXX
SRAM Module, 2MX8, 35ns, CMOS, CPGA66Manufacturer: Microsemi Corporation
Categories: SRAMs
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Microsemi Corporation's 5962-9461107HXX is a 16 Mbit (2M x 8) CMOS SRAM module featuring a maximum access time of 35ns. This component offers flexible configuration as either 512K x 32 or 1M x 16, with TTL-compatible input/output. It operates asynchronously and is rated for an extended temperature range of -55°C to +125°C. The module is housed in a 66-pin Ceramic Pin Grid Array (CPGA) package, conforming to MIL-PRF-38534 standards. Applications for this high-reliability memory module are found in aerospace, defense, and industrial systems requiring robust data storage solutions. The 5962-9461107 series SRAMs are designed for demanding environments.
Additional Information
Series: 5962-9461107RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 30.1000 |
| Width | 30.1000 |
| Technology | CMOS |
| Access_Time_Max | 35.0000000000000000 |
| Additional_Feature | CONFIGURABLE AS 512K X 32 OR 1M X 16; TTL COMPATIBLE INPUT OUTPUT |
| JESD_30_Code | S-CPGA-P66 |
| Memory_Density | 16777216.0000000000000000 |
| Memory_IC_Type | SRAM MODULE |
| Memory_Organization | 2MX8 |
| Memory_Width | 8 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 66 |
| Number_of_Words | 2097152.0000000000000000 |
| Number_of_Words_Code | 2M |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | PGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-PRF-38534 |
| Seated_Height_Max | 5.8400 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | PIN/PEG |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Perpendicular |
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