5962-9318705HUC
SRAM Module, 512KX8, 55ns, CMOS, CPGA66Manufacturer: Microsemi Corporation
Categories: SRAMs
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Microsemi Corporation 5962-9318705HUC is a 4 Megabit CMOS SRAM module featuring a 512K x 8 memory organization with an asynchronous access time of 55ns. This component, part of the 5962-9318705 series, is housed in a 66-lead Ceramic Pin Grid Array (CPGA) package with a JEDEC JESD30 code of S-CPGA-P66. It operates over a temperature range of -55°C to +125°C with a supply voltage of 4.5V to 5.5V. The module supports parallel data transfer and is manufactured to MIL-STD-883 standards, indicating its suitability for demanding applications in aerospace and defense. The SRAM can also be user-configured as a 128K x 32 device, offering design flexibility.
Additional Information
Series: 5962-9318705RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 30.1000 |
| Width | 30.1000 |
| Technology | CMOS |
| Access_Time_Max | 55.0000000000000000 |
| Additional_Feature | USER CONFIGURABLE AS 128K X 32 |
| JESD_30_Code | S-CPGA-P66 |
| Memory_Density | 4194304.0000000000000000 |
| Memory_IC_Type | SRAM MODULE |
| Memory_Organization | 512KX8 |
| Memory_Width | 8 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 66 |
| Number_of_Words | 524288.0000000000000000 |
| Number_of_Words_Code | 512k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | PGA |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-STD-883 |
| Seated_Height_Max | 6.2200 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | PIN/PEG |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Perpendicular |
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