WED3C755E8MF-300BM
RISC Microprocessor, 300MHz, CMOS, CBGA255Manufacturer: Microsemi Corporation
Categories: Microprocessors
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Microsemi Corporation WED3C755E8 RISC Microprocessor, part number WED3C755E8MF-300BM, offers a 300MHz clock speed within a CBGA255 package. This CMOS component features a 32-bit address bus and a 64-bit external data bus, supporting fixed-point operations. Integrated cache enhances performance, while low-power modes are available for energy efficiency. The device operates across a wide temperature range of -55°C to +125°C, with a supply voltage range of 1.9V to 2.1V, nominal at 2.0V. The ceramic, metal-sealed cofired package, a rectangular grid array, has 255 terminals with a 1.270mm pitch. This microprocessor is suitable for demanding applications in aerospace, defense, and high-performance computing.
Additional Information
Series: WED3C755E8RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Speed | 300.00000000 |
| Technology | CMOS |
| Address_Bus_Width | 32 |
| Boundary_Scan | No |
| Clock_Frequency_Max | 66.0000000000000000 |
| External_Data_Bus_Width | 64 |
| Integrated_Cache | Yes |
| JESD_30_Code | R-CBGA-B255 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 255 |
| Operating_Temperature_Max | 125.0000 |
| Operating_Temperature_Min | -55.0000 |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 3.8500 |
| Supply_Voltage_Max | 2.1000 |
| Supply_Voltage_Min | 1.9000 |
| Supply_Voltage_Nom | 2.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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