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WED3C755E8MC-350BH9C

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WED3C755E8MC-350BH9C

RISC Microprocessor, 350MHz, CMOS, CBGA255

Manufacturer: Microsemi Corporation

Categories: Microprocessors

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Microsemi Corporation WED3C755E8MC-350BH9C is a 350MHz RISC microprocessor utilizing CMOS technology. This component features a 32-bit address bus width and a 64-bit external data bus. It supports boundary scan and incorporates integrated cache for enhanced performance. The WED3C755 series microprocessor operates within a temperature range of 0°C to 70°C and requires a supply voltage between 1.9V and 2.1V, with a nominal value of 2.0V. Its robust construction is evident in the CERAMIC, METAL-SEALED COFIRED package, a R-CBGA-B255 (CBGA255) grid array with a rectangular shape. The component is surface-mount with ball terminals on a 1.270mm pitch. Additional features include LG-MAX, WD-MAX, and SEATED HT-CALCULATED capabilities, along with low-power mode support. This microprocessor is suitable for applications in networking, telecommunications, and industrial control systems.

Additional Information

Series: WED3C755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:
Technical Details:
FormatFixed Point
Speed350.00000000
Width21.2100
TechnologyCMOS
Length25.2500
Additional_FeatureLG-MAX;WD-MAX;SEATED HT-CALCULATED
Address_Bus_Width32
Boundary_ScanYes
External_Data_Bus_Width64
Integrated_CacheYes
JESD_30_CodeR-CBGA-B255
Low_Power_ModeYes
Number_of_Terminals255
Operating_Temperature_Max70.0000
Operating_Temperature_Min0.0000
Package_Body_MaterialCERAMIC, METAL-SEALED COFIRED
Package_CodeBGA
Package_ShapeRectangular
Package_StyleGRID ARRAY
Seated_Height_Max3.2620
Supply_Voltage_Max2.1000
Supply_Voltage_Min1.9000
Supply_Voltage_Nom2.0000
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.270
Terminal_PositionBottom
uPs_uCs_Peripheral_ICs_TypeMICROPROCESSOR, RISC

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