WED3C755E8MC-300BH9C
RISC Microprocessor, 300MHz, CMOS, CBGA255Manufacturer: Microsemi Corporation
Categories: Microprocessors
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Microsemi Corporation WED3C755 RISC Microprocessor, WED3C755E8MC-300BH9C. This 32-bit RISC microprocessor operates at 300MHz, utilizing CMOS technology. It features a 64-bit external data bus and integrated cache for enhanced performance. The component supports low-power modes and boundary scan functionality. Packaged in a 255-terminal R-CBGA-B255 ceramic grid array with a rectangular footprint, it is designed for surface mounting. Key features include LG-MAX, WD-MAX, and SEATED HT-CALCULATED. Applications span industrial control, telecommunications infrastructure, and high-performance embedded systems. Operating temperature range is 0°C to 70°C with a nominal supply voltage of 2.0V, ranging from 1.9V to 2.1V.
Additional Information
Series: WED3C755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Speed | 300.00000000 |
| Width | 21.2100 |
| Technology | CMOS |
| Length | 25.2500 |
| Additional_Feature | LG-MAX;WD-MAX;SEATED HT-CALCULATED |
| Address_Bus_Width | 32 |
| Boundary_Scan | Yes |
| External_Data_Bus_Width | 64 |
| Integrated_Cache | Yes |
| JESD_30_Code | R-CBGA-B255 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 255 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 3.2620 |
| Supply_Voltage_Max | 2.1000 |
| Supply_Voltage_Min | 1.9000 |
| Supply_Voltage_Nom | 2.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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