WED3C755E8MC-300BC
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255Manufacturer: Microsemi Corporation
Categories: Microprocessors
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Microsemi Corporation WED3C755 series 32-bit RISC microprocessor, part number WED3C755E8MC-300BC, operates at 300MHz with a 2.0V nominal supply voltage, ranging from 1.9V to 2.1V. This CMOS component features a 64-bit address and external data bus, incorporating integrated cache and supporting low-power modes. Boundary scan is enabled. The device is housed in a CBGA255 package with a rectangular shape, grid array style, and ceramic, metal-sealed cofired body material. It utilizes ball terminals with a 1.270mm pitch. Applications span industries requiring high-performance processing, including telecommunications, defense, and industrial automation. The component offers LG-MAX, WD-MAX, and SEATED HT-CALCULATED features. Operating temperature ranges from 0°C to 70°C.
Additional Information
Series: WED3C755RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Format | Fixed Point |
| Speed | 300.00000000 |
| Width | 21.2100 |
| Technology | CMOS |
| Length | 25.2500 |
| Additional_Feature | LG-MAX;WD-MAX;SEATED HT-CALCULATED |
| Address_Bus_Width | 64 |
| Bit_Size | 32 |
| Boundary_Scan | Yes |
| External_Data_Bus_Width | 64 |
| Integrated_Cache | Yes |
| JESD_30_Code | R-CBGA-B255 |
| Low_Power_Mode | Yes |
| Number_of_Terminals | 255 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | CERAMIC, METAL-SEALED COFIRED |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA255,16X16,50 |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Seated_Height_Max | 3.8500 |
| Supply_Voltage_Max | 2.1000 |
| Supply_Voltage_Min | 1.9000 |
| Supply_Voltage_Nom | 2.0000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
| uPs_uCs_Peripheral_ICs_Type | MICROPROCESSOR, RISC |
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