VSC2202
Microprocessor, PBGA673Manufacturer: Microsemi Corporation
Categories: Microprocessors
Quality Control: Learn More
Microsemi Corporation's VSC2202 is a high-performance microprocessor housed in a 673-ball grid array (PBGA673) package. With a terminal pitch of 1.270 mm and a square package shape, this device offers robust connectivity for demanding applications. The VSC2202 operates within a temperature range of 0°C to 70°C and utilizes a nominal supply voltage of 1.2V. Fabricated with plastic/epoxy molding compound, it features bottom-mounted ball terminals for reliable surface mounting. This component is suitable for use in industries such as telecommunications and data processing, where advanced processing capabilities are essential.
Additional Information
Series: VSC2202RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B673 |
| Number_of_Terminals | 673 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA673,29X29,50 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Supply_Voltage_Nom | 1.2000 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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