PM2329
Microprocessor, PBGA352Manufacturer: Microsemi Corporation
Categories: Microprocessors
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The Microsemi Corporation PM2329 is a high-performance microprocessor housed in a 352-ball grid array (BGA) package. Featuring a square, bottom-terminal configuration with a 1.270mm pitch, this component is designed for demanding applications. The S-PBGA-B352 standard package is constructed from plastic/epoxy materials, suitable for surface-mount assembly. Operating within a temperature range of 0°C to 70°C, the PM2329 is utilized in various industrial and commercial sectors requiring robust processing capabilities. This component is part of the PM2329 series.
Additional Information
Series: PM2329RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| JESD_30_Code | S-PBGA-B352 |
| Number_of_Terminals | 352 |
| Operating_Temperature_Max | 70.0000 |
| Operating_Temperature_Min | 0.0000 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA352,26X26,50 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.270 |
| Terminal_Position | Bottom |
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