
Microsemi Corporation's Fusion® AFS090-FGG256I is a high-performance Field Programmable Gate Array (FPGA) designed for demanding applications. This device features 90,000 typical gates and supports 75 user I/O pins, offering significant flexibility for custom logic implementation. With 27,648 RAM bits, it provides ample on-chip memory for data buffering and storage. The AFS090-FGG256I operates within a temperature range of -40°C to 100°C (TJ) and requires a supply voltage of 1.425V to 1.575V. It is housed in a 256-pin Fine-Pitch Ball Grid Array (FPBGA) package, measuring 17x17mm, suitable for surface mounting. This component is commonly utilized in industrial control systems, telecommunications infrastructure, and advanced aerospace and defense platforms.
Additional Information
Series: Fusion®RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 256-LBGA |
| Mounting Type | Surface Mount |
| Number of Gates | 90000 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 1.425V ~ 1.575V |
| Supplier Device Package | 256-FPBGA (17x17) |
| Total RAM Bits | 27648 |
| Number of I/O | 75 |
| Programmable | Not Verified |