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A1010B-PLG68C

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A1010B-PLG68C

IC FPGA 57 I/O 68PLCC

Manufacturer: Microsemi Corporation

Categories: FPGAs (Field Programmable Gate Array)

Quality Control: Learn More

Microsemi Corporation ACT™ 1 Field Programmable Gate Array (FPGA) IC, part number A1010B-PLG68C. This device offers 1200 typical gates and features 57 user I/O pins within a 68-PLCC package. Designed for surface mount applications, it operates from a 4.5V to 5.5V supply and has an operating temperature range of 0°C to 70°C. The A1010B-PLG68C is utilized in telecommunications, industrial control, and military/aerospace applications requiring flexible logic implementation. The component is supplied in tray packaging.

Additional Information

Series: ACT™ 1RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tray
Technical Details:
PackagingTray
Package / Case68-LCC (J-Lead)
Mounting TypeSurface Mount
Number of Gates1200
Operating Temperature0°C ~ 70°C (TA)
Voltage - Supply4.5V ~ 5.5V
Supplier Device Package68-PLCC (24.23x24.23)
Number of LABs/CLBs295
Number of I/O57
ProgrammableNot Verified

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FPGA FAQs

A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device that engineers can configure after manufacturing to perform custom hardware functions. Unlike CPUs or GPUs, FPGAs process data in parallel, making them ideal for high-speed computing, AI acceleration, telecommunications, aerospace, industrial automation, and embedded systems.

An FPGA works by using programmable logic blocks and configurable interconnects that engineers customize using hardware description languages (HDLs) such as VHDL or Verilog. This architecture allows the FPGA to process multiple operations simultaneously for real-time performance and low latency.

FPGAs are used in:

  • AI and machine learning acceleration
  • Telecommunications infrastructure
  • Industrial automation
  • Aerospace and defense systems
  • Automotive electronics
  • Video and image processing
  • Embedded computing applications

The difference between an FPGA and a CPU is architecture. CPUs execute instructions sequentially, while FPGAs process data in parallel using customizable hardware logic. This makes FPGAs faster for specialized workloads like AI inference, signal processing, and real-time computing.

CPLDs are optimized for simpler control logic and predictable timing, while FPGAs provide higher logic density and advanced parallel processing for complex applications.

ASICs are custom-built for a specific application, delivering maximum performance, power efficiency, and unit cost optimization at high volumes, while FPGAs offer reprogrammability, faster development cycles, and greater design flexibility for evolving or lower-volume applications.

Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.