A2F200M3F-1FGH256Y
200000 Gates, 4608-Cell, CMOS, PBGA256Manufacturer: Microsemi Corporation
Categories: Field Programmable Gate Arrays
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Microsemi Corporation's A2F200M3F-1FGH256Y is a 200,000-gate FPGA SoC utilizing a 4608-cell CMOS architecture. This device, part of the A2F200 series, is housed in a 256-terminal Ball Grid Array (BGA) package with a 1.00 mm terminal pitch. It operates within a temperature range of 0°C to 85°C and supports a nominal supply voltage of 1.5V, with a range of 1.425V to 1.575V. The A2F200M3F-1FGH256Y is designed for surface mounting and features a low-profile square package measuring 17mm x 17mm. Its organization of 200,000 gates and 4608 logic cells, coupled with 117 inputs and 117 outputs, makes it suitable for applications in communications, industrial control, and defense systems.
Additional Information
Series: A2F200RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 17.0000 |
| Technology | CMOS |
| Length | 17.0000 |
| JESD_30_Code | S-PBGA-B256 |
| Number_of_Equivalent_Gates | 200000 |
| Number_of_Inputs | 117 |
| Number_of_Logic_Cells | 4608 |
| Number_of_Outputs | 117 |
| Number_of_Terminals | 256 |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 200000 GATES |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | LBGA |
| Package_Equivalence_Code | BGA256,16X16,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY, LOW PROFILE |
| Programmable_Logic_Type | FPGA SOC |
| Seated_Height_Max | 1.7000 |
| Supply_Voltage_Max | 1.57500 |
| Supply_Voltage_Min | 1.42500 |
| Supply_Voltage_Nom | 1.5 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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