WEDPND8M72S-250BM
DDR DRAM Module, 8MX72, 0.8ns, CMOS, PBGA219Manufacturer: Microsemi Corporation
Categories: DRAMs
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Microsemi Corporation WEDPND8M72S-250BM is a DDR DRAM Module with an 8Mx72 organization, offering a density of 603,979,776 bits. This component operates with a maximum access time of 0.8ns and features a CMOS technology. The module supports a FOUR BANK PAGE BURST access mode and includes AUTO REFRESH functionality. It operates synchronously and is housed in a PBGA219 package, identified by JESD-30 code R-PBGA-B219. The operating temperature range is from -55°C to 125°C, with a nominal supply voltage of 2.5V, ranging from 2.3V to 2.7V. This high-performance memory solution is suitable for demanding applications in industries such as aerospace, defense, and industrial automation.
Additional Information
Series: WEDPND8M72RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | CMOS |
| Access_Mode | FOUR BANK PAGE BURST |
| Access_Time_Max | 0.8000000000000000 |
| Additional_Feature | AUTO REFRESH |
| JESD_30_Code | R-PBGA-B219 |
| Memory_Density | 603979776.0000000000000000 |
| Memory_IC_Type | DDR DRAM MODULE |
| Memory_Organization | 8MX72 |
| Memory_Width | 72 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 219 |
| Number_of_Words | 8388608.0000000000000000 |
| Number_of_Words_Code | 8M |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Shape | Rectangular |
| Package_Style | GRID ARRAY |
| Supply_Voltage_Max | 2.70000 |
| Supply_Voltage_Min | 2.30000 |
| Supply_Voltage_Nom | 2.5 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Position | Bottom |
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